5 energy way, west warwick, ri 02893 usa tel: 800-424-9850 / 401-823-5200 fax: 401-823-8723 e-mail: info@advintcorp.com internet: www.advintcorp.com 2 rev. 4/01 products shown covered by patents issued and/or pending. specifications subject to change without noti ce. dimensions shown: inch/(mm) . ball grid array (bga) adapters adapter features ? soldering bga to adapter subjects bga to less thermal stress than soldering bga directly to a pcb due to adapters lower mass. ? uses same footprint as bga device. ? custom adapters available for heat sink attachments. specifications terminals: brass; copper alloy (c36000), astm-b-16 plating: g C gold over nickel body material: f C fr-4 glass epoxy, u.l. rated 94v-0 terminals 1.27mm and 1.5mm pitch 1.0mm pitch 0.80mm pitch 0.75mm pitch standard adapter (a) ? mates with standard socket (s) ? adapter size equals bga device body + .079 in. (2.0mm) extraction slot adapter (ax) ? slots allow easy device/adapter assembly removal from socket with advanced ? extraction tool without damaging valuable pcb ? mates with extraction socket (sb) or guide post socket (sg) ? adapter size equals bga device body + .157 in. (4.0mm) advanced ? bga adapter extraction tools how to order C bga adapters 1 f g a xxxx - 638 g footprint dash# if applicable* terminal plating g - gold terminal type see options at left body type f - fr-4 model type a = standard adapter ax = extraction slot adapter [1.5, 1.27, & 1.0mm pitch only] pitch b = .059/(1.5mm) g = .050/(1.27mm) h = .039/(1.0mm) j = .0315/(0.80mm) k = .0295/(0.75mm) number of positions *see bga footprint booklet or web site .018/(0.46) dia. .182 (4.62) type -638 .011/(0.28) dia. .159 (4.04) type -715 device package size < 1.024 (26mm) > 1.024 (26mm) tool p/n 5566 5504 blade width .373 in. .675 in. blade width bga body + .079/(2.0) bga device .039/(1.0) bga device bga body + .157/(4.0) .079/(2.0) p/n 5504 p/n 5566 .011/(0.28) dia. .146 (3.71) type -700 now available in 0.75mm pitch .008/(0.20) dia. .142 (3.61) type -757
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